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Intel® 7300 Chipset

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Intel® 7300 Chipset

The Intel® 7300 Chipset with Data Traffic Optimizations improve data movement across Intel® Xeon® processor 7300 series-based servers by increasing interconnect bandwidth, optimizing system bandwidth, increasing memory capacity, and improving network traffic processing while reducing I/O latency as compared to previous platforms.

The Intel® 7300 Chipset matches the improved performance of the Intel® Xeon® processor 7300 series and Intel® Xeon® processor 7200 series to bring additional performance and platform improvements to the expandable segment. The chipsets incorporate four high-speed interconnects that move data at 1066 MT/s (megatransfers per second), FBDIMM support for up to 256 GB of memory capacity, a 64MB cached snoop filter for reduced traffic on the dedicated high speed interconnects, and improvements to Intel® I/O Acceleration Technology. Additionally, the Intel® 7300 Chipset has 28 lanes of PCI Express* with support for third party expanders for additional I/O.

Features and benefits
Supports four Intel® Xeon® processors 7300 series and Intel® Xeon® processor 7200 series All platforms are optimized for the expandable server market segment (virtualization, database, & ERP).
1066 MHz dual independent buses Increased bus bandwidth of up to 2X over 800MHz systems.
FB DIMM 533/667 MHz memory interface

Offers a maximum memory bandwidth up to 21 GB/s for 667 MHz.


Increased dual in-line memory modules (DIMMs) per system provide enhanced memory scalability for memory-intensive applications.
PCI Express* I/O Serial I/O technology provides a direct connection between the MCH chipset and PCI Express component/adapters with bandwidth up to 4 GB/s on each PCI Express x8 interface. PCI Express offers higher bandwidth, lower latency and fewer I/O bottlenecks than PCI-X.
Intel® 6700PXH 64-bit PCI Hub

Optional component introduces next-generation PCI/PCI-X performance and significant enhancements to platform flexibility.


Supports two independent 64-bit, 133 MHz PCI-X segments and two Hot-Plug controllers (one per segment).
Advanced platform reliability, availability, and serviceability (RAS) Features such as memory Error Correction Code (ECC), Intel® x4 Single Device Data Correction (x4 SDDC), DIMM sparing and DIMM scrubbing for improved system reliability.
Packaging information
Intel® 7300 Chipset Memory Controller Hub (MCH) 2013 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 6700PXH 64-bit PCI Hub 567 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 632xESB I/O Controller Hub 1284 Flip Chip - Ball Grid Array (PBGA)

Additional information: 1

Produkt- och prestandainformation

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1. Intel®-processorer och/eller Intel®-chipsets kan innehålla designdefekter eller fel som kallas för tryckfel som kan leda till att produkten avviker från publicerade specifikationer. Aktuella betecknade tryckfel finns att få på begäran.