Jenna Hartley wants to pursue medical research to help people, including helping CF patients with new treatments to fight Pseudomonas infections.
Jenna Hartley, Intel International Science and Engineering Fair participant, wants to join the medical field so she can help people through research, such as her search into new treatments for Pseudomonas infections in cystic fibrosis patients.Helsidesvisning >
Intel Labs research scientist Margie Morris discusses the Verbalucce engine and analyzing how we talk to each other to improve communication.
Intel Labs research scientist Margie Morris discusses the development of the Verbalucce engine and analyzing the ways people talk to each other to help us become better communicators on a global level.Helsidesvisning >
The creators discuss the challenges behind the Titan Arm exoskeleton and how it can improve lives through physical therapy and occupational lifting.
The creators of the Titan Arm discuss the challenges they faced to create the powered upper body exoskeleton that can make lives better by assisting with physical therapy and occupational lifting.Helsidesvisning >
Intel’s Vu Nguyen demonstrates life without keys via facial geometry and biometric data technology, enabling each person to become their own key.
Navajo teen Raquel Redshirt uses everyday materials to build solar ovens, fulfilling Navajo community needs and winning an Intel ISEF competition.
Rosalind Hudnell, Intel Director of Global Diversity and Inclusion, discusses the high value Intel places on a diverse workforce.
Shows processor insertion into the Intel® LGA115X Series socket independent loading mechanism to minimize handling damages to socket contacts.
Teams from the Intel For Change summit share why they are going to Ecuador, India, and Kenya to learn about local barriers to education for girls.
Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.
Demonstrates guidelines for package-on-package device rework, including developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.Helsidesvisning >
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