Demonstration of concept to bring the endcap to life using Intel embedded technology.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.