Demonstration of concept to bring the endcap to life using Intel embedded technology.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Intel’s ESD prevention methods prevent costly damage to electronic devices.